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• Microelectronics • 3D Non Contact Surface Metrology • • Bond Testers • • Die Bond and Sort • • • • • Dispensing • • Hermetic Sealing Systems and Package Lidders • • Molding, Trim and Form, Singulation • • Plasma Systems • • Vacuum Soldering Systems • • • Wire Bonder • • • Test and Programming • Test Equipment • • • Device Programming • • 1st Article Inspection • • AOI Systems • • • Software Solutions • • • • • • Metrology • 3D Non Contact • • Thermal Warpage and Strain Metrology • • Applications • • • Service and Support • • • • • • • •. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

Equipped with integrated dispenser, 12' wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.